Quote:
Originally Posted by Qtx
Unfortunately it always seems to be newer models i'm seeing the mobo's go on. When I have looked up the price they have been a couple of hundred quid when it comes to the vaio's. Nice laptops but sony prices...
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IMHO it's the chip packaging changes that are bringing in unreliability. When most ICs were gull wing LQFPs (Leaded Quad Flat Pack) the Mobo could take flexing and heating effects in it stride as the leads cushioned the solder connections. Now with BGA (Ball Grid Array) packages there's much less tolerance to flexing. Unfortunately getting all the fuctionality into a small space has necessitated extreme miniaturisation. The only way to inspect the soldering on those packs is with X-Rays as you cannot see the connections.
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