Quote:
Originally Posted by Kymmy
Right gear or do you mean Bodge gear 
The problem with ball grid array is that you need to be bloody accurate with no main reference points. That means normally a computerized tool to accurately position the device which means full set-up params for each board (something manufacturers don't tend to give out) and even as certified warranty agents for Toshiba, IBM, HP, ACER and a few others we never did it..
It can be done with IR or hot-air but it's very hit and miss, at least with TQFP you have reference points (the legs and tracks themselves) |
Actually I meant 65000 worth of BGA rework station with computerized placement system and x-ray inspection. placement params are easier with micrometric optical alignment prior to BGA placement, it does a video overlay so you can accurately line up the BGA points for non-profiled circuits. Vacuum assisted extraction and placement, it's quite a nice tool but somewhat expensive.