Quote:
Originally Posted by zinglebarb
yes do that and if the air is disturbed by the side fans or is not being drawn out correctly alter your cooling 
imo pic is ideal airflow |
Well thats a standard approach to doing cooling, not sure i would call it ideal though. But its about the best you're going to get with ATX, BTX on the other hand was a much better idea its such a shame that its not really taking off as its much quieter and much more efficent way of doing air cooling.
Back to the amd chip thing somthing just doesnt smell right. Generally pre-release engineering samples and alike run slightly slower than what the manufacturer then ships as tweaks are made to the design which squeezes abit more performance out of them.
I dont really see the point of what they have done aside from a 'look at us we can make a 3GHz chip too'.
You would have to assume that there is somthing significantly wrong with it else they would be 'leaking' performance figures from the chip at just how much it thrashes an intel chip, or at least some kind of benchmark other than showing its off the scale on windows performance index.
When removing a heatsink its much better to try and slide it off than pull it off. As the thermal goop can as you have shown can stick on pretty well.
When you apply your own thermal grease and then move the heatsink around abit on the chip to squeeze out all the air bubbles you will find then that the sink becomes 'sucked' onto the chip and is difficult to pull off.
Edit - what i meant to say all along.
There has long been a debate over whether you should run your computer with slightly positive (more air in than out) or slightly negative pressure (more out than in)
A downside of negative pressure is that air is pulled in from other sources (poor shutlines on case etc) and you find dust creeps in everywhere. this does not happen if you have slightly positive pressure and as long as your inlet is well filtered you dont get a dust build up inside the case.